可复制提示词
{"type":"宽幅未来感科技行业信息图","title":"{argument name=\"headline text\" default=\"GOOGLE TPU 生态系统:垂直整合与挑战 NVIDIA\"}","style":"深蓝色等距矢量信息图,发光的青色电路路径,霓虹高光,3D 芯片和数据中心图标,简洁的企业科技演示风格,高对比度白色大写标签,带有细微的投影,16:9 横屏","layout":{"background":"蓝灰色渐变背景,带有淡淡的电路纹理,所有节点通过发光的青色数据流线连接","main_flow":"从左到右的生态系统地图,展示了 Google TPU 从算法和 ASIC 设计到制造、网络、系统组装以及 AI 模型训练的供应链","discrete_labeled_sections_count":8,"sections":[{"title":"GOOGLE BRAIN:算法","position":"左上","visual":"发光的大脑轮廓图标,向生态系统输送青色数据流"},{"title":"设计转换器:定制 ASIC 设计","position":"左中","count":2,"labels":["BROADCOM","MEDIATEK"],"visual":"两个小型芯片设计工作站,通过箭头连接,左侧为 Broadcom,右侧为 MediaTek"},{"title":"高速连接","position":"左下","visual":"电路板布线和发光的数据链路,汇入中央 TPU 封装"},{"title":"物理构建者","position":"中上","count":1,"labels":["TSMC"],"visual":"等距半导体工厂,带有明亮的蓝色屋顶核心,垂直连接至中央芯片"},{"title":"制造与封装","position":"中下","count":1,"labels":["TSMC"],"visual":"大型中央堆叠式 TPU 芯片封装,位于电路基板上,发光的青色处理器核心,多层封装块"},{"title":"网络神经","position":"中右上","count":1,"labels":["ZHONGJI INNOLIGHT"],"visual":"服务器塔群,通过发光的网状网络连接,数据流向下流动"},{"title":"系统组装","position":"右中","count":1,"labels":["INVENTEC"],"visual":"机架式服务器和一个连接至主 TPU 数据流的长型组装模块"},{"title":"AI 模型训练 (GEMINI)","position":"右下","visual":"大型发光的线框球体,带有连接的节点,代表 AI 训练输出"}]},"comparison_panel":{"title":"核心对比:TPU VS. GPU","position":"右上","panel_style":"圆角矩形卡片,垂直分割,左侧为青色 Google TPU,右侧为紫色 Nvidia GPU","columns_count":2,"columns":[{"heading":"GOOGLE TPU","icon":"青色处理器图标","points_count":3,"points":["性能效率 (瓦特/性能)","成本优化","垂直整合优势"]},{"heading":"NVIDIA GPU","icon":"紫色芯片图标,标注为 GPU","points_count":3,"points":["强大的 CUDA 生态系统","功耗与成本挑战","垂直整合优势(显示为中央箭头对比标记)"]}]},"visual_elements":{"company_labels_count":5,"company_labels":["BROADCOM","MEDIATEK","TSMC","ZHONGJI INNOLIGHT","INVENTEC"],"major_icons_count":9,"major_icons":["大脑","两个 ASIC 设计工作站","半导体工厂","中央封装 TPU 芯片","网络服务器网格","组装机架服务器","对比卡片","GPU 芯片","AI 训练球体"]},"customization":"保持所有文本清晰可读,保留精确的大写标签,使用适合解释 TPU 产业链的精致金融研究信息图风格。通过明亮的青色数据路径和高端科技美学,强调 {argument name=\"highlight theme\" default=\"垂直整合与挑战 NVIDIA\"} 的主题。"}
提示词拆解
{"type":"宽幅未来感科技行业信息图","title":"{argument name=\"headline text\" default=\"GOOGLE TPU 生态系统:垂直整合与挑战 NVIDIA\"}","style":"深蓝色等距矢量信息图,发光的青色电路路径,霓虹高光,3D 芯片和数据中心图标,简洁的企业科技演示风格,高对比度白色大写标签,带有细微的投影,16:9 横屏","layout":{"background":"蓝灰色渐变背景,带有淡淡的电路纹理,所有节点通过发光的青色数据流线连接","main_flow":"从左到右的生态系统地图,展示了 Google TPU 从算法和 ASIC 设计到制造、网络、系统组装以及 AI 模型训练的供应链","discrete_labeled_sections_count":8,"sections":[{"title":"GOOGLE BRAIN:算法","position":"左上","visual":"发光的大脑轮廓图标,向生态系统输送青色数据流"},{"title":"设计转换器:定制 ASIC 设计","position":"左中","count":2,"labels":["BROADCOM","MEDIATEK"],"visual":"两个小型芯片设计工作站,通过箭头连接,左侧为 Broadcom,右侧为 MediaTek"},{"title":"高速连接","position":"左下","visual":"电路板布线和发光的数据链路,汇入中央 TPU 封装"},{"title":"物理构建者","position":"中上","count":1,"labels":["TSMC"],"visual":"等距半导体工厂,带有明亮的蓝色屋顶核心,垂直连接至中央芯片"},{"title":"制造与封装","position":"中下","count":1,"labels":["TSMC"],"visual":"大型中央堆叠式 TPU 芯片封装,位于电路基板上,发光的青色处理器核心,多层封装块"},{"title":"网络神经","position":"中右上","count":1,"labels":["ZHONGJI INNOLIGHT"],"visual":"服务器塔群,通过发光的网状网络连接,数据流向下流动"},{"title":"系统组装","position":"右中","count":1,"labels":["INVENTEC"],"visual":"机架式服务器和一个连接至主 TPU 数据流的长型组装模块"},{"title":"AI 模型训练 (GEMINI)","position":"右下","visual":"大型发光的线框球体,带有连接的节点,代表 AI 训练输出"}]},"comparison_panel":{"title":"核心对比:TPU VS.
GPU","position":"右上","panel_style":"圆角矩形卡片,垂直分割,左侧为青色 Google TPU,右侧为紫色 Nvidia GPU","columns_count":2,"columns":[{"heading":"GOOGLE TPU","icon":"青色处理器图标","points_count":3,"points":["性能效率 (瓦特/性能)","成本优化","垂直整合优势"]},{"heading":"NVIDIA GPU","icon":"紫色芯片图标,标注为 GPU","points_count":3,"points":["强大的 CUDA 生态系统","功耗与成本挑战","垂直整合优势(显示为中央箭头对比标记)"]}]},"visual_elements":{"company_labels_count":5,"company_labels":["BROADCOM","MEDIATEK","TSMC","ZHONGJI INNOLIGHT","INVENTEC"],"major_icons_count":9,"major_icons":["大脑","两个 ASIC 设计工作站","半导体工厂","中央封装 TPU 芯片","网络服务器网格","组装机架服务器","对比卡片","GPU 芯片","AI 训练球体"]},"customization":"保持所有文本清晰可读,保留精确的大写标签,使用适合解释 TPU 产业链的精致金融研究信息图风格。通过明亮的青色数据路径和高端科技美学,强调 {argument name=\"highlight theme\" default=\"垂直整合与挑战 NVIDIA\"} 的主题。"}
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